Datasheet stspin830 compact and versatile threephase. Mp2384 24v, 4a, low i q, synchronous, buck converter. The device contains a low onresistance pchannel mosfet that supports. V the converter requires a minimal number of external components and is available in a qfn11 2mmx2mm package. For additional information, see the an617 application note, microcsp. This load switch provides power domain isolation for extended power battery life. Thermal resistance between the device and the printed circuit board per jedec jesd51 8. Guidelines for reporting and using electronic package thermal information. Jesd519 was developed to give a figureofmerit of thermal performance that allows for accurate comparisons of packages from different suppliers. Understanding the jedec integrated circuit thermal test standards thermal minutes the entity that has taken on the task of establishing benchmarks in the electronics industry is the jedec solid state technology association.
Jesd5110, test boards for throughhole perimeter leaded package thermal measurements, july 2000. Pdf tb379 jesd519 jep140 jep140 jesd5110 jedec jesd518 jesd515 jesd5 jc jb jt thermal resistance standards reliability test methods for packaged devices. Per jedec jesd516 with the board jesd517 horizontal. Eia jesd51 2 environment and eia jesd51 3 pcb with standard footprint dimensions connected with 5 a rated printed wiring track widths. See jesd518, jesd519, and jesd5112 for more detailed. See figure 8 for current ratings at other durations. Eiajesd512 environment and pcb has standard footprint dimen sions. Feedback input bias current ifb 10250 na output current i out 1 anotes 1 to 3, figure 27 switching characteristics switching frequency fsw 425 500 575 khz maximum duty cycle dcmax 85 94 % note 3 minimum duty cycle dcmin 2 %note 4 highside nmos switchon. Password protect pdf encrypt your pdf online safely.
Test boards for throughhole perimeter leaded package thermal measurements. See vout, pvin descriptions and layout recommendation for more details. Test boards for area array surface mount package thermal measurements jesd5110. It is suitable for protecting 1cell lithiumion lithium polymer rechargeable. Logic controlled, highside power switch with reverse current. Eiajesd512 environment and eiajesd5 pcb with standard footprint dimensions connected with 5 a rated printed wiring track widths. Per jedec jesd512 with natural convection for horizontally oriented board. Encrypt your pdf with a password to prevent unauthorized access to the file content, especially for file sharing or archiving. It is specially designed for offline adapter application, dvdp, vcr, lcd monitor application, and auxiliary. Connect these pins to the ground electrode of the input and output filter capacitors. Eiajesd512 environment and pcb has standard footprint dimensions connected with 5 a rated printed wiring track widths. Capfree, nmos, 400ma lowdropout regulator with reverse. Jb junction to board characterization according to jesd512a1 22.
Per semi g3887 and jedec jesd512 with the singlelayer board jesd5 horizontal. The max30034 is a patentpending protection device intended to with the help of external, energyrated resistors absorb repetitive defibrillation and other highenergy pulses to protect sensitive electronic circuitry in ecg and other medicalindustrial equipment. The purpose of this jedec standard is to verify the workmanship and requirements of microelectronic packages and covers lids intended for use in fabricating hybrid microelectronic circuitsmicrocircuits hereafter referred to as microcircuits. This trade group, originally the joint electron device engineering council. Ja depends on the package, board, airflow, radiation, and system characteristics. Max14941max14942 v solate ps aldple bs s ransceiers with v.
The t3ster software produces two types of structure function curves. Rex t general description key specifications vinres pwm in. No specific jedec standard test exists, but a close description can be found in the ansi semi standard g3088. No specific jedecstandard test exists, but a close description can be found in the ansi semi standard g3088. The jesd5112, guidelines for reporting and using package, 8 and jesd5112 for more detailed specifications on this parameter.
Jesd5 dap11 thermal via an78 jesd22a114 jesd51 100k adj dap 11. Wp how to measure thermal resistance o e emitters an e arras white paer umiles holin all rihts resere ite ape how to measure thermal resistance of led emitters and led arrays purpose to describe the process used to determine typical thermal resistance values from the led junction to case and led junction to ts reference point. See figure 9 for the current ratings at other durations. It is designed to buffer the load device from excessive input voltage which can damage sensitive circuits and to protect the input side. The fan7602 is a green current mode pwm controller. Table 1 product summary parameter symbol values minimum operating voltage vsop 4. It can be used to give a first order approximation of system performance and, in conjunction with the other jesd51 pcb standards, allows for comparisons of the various package families. Jesd518 environmental conditions for a measurement of junctiontoboard thermal resistance jesd519 thermal test board design for ball grid array bga and land grid array lga jesd5110 thermal test board design for dualinline packages dip and singleinline packages sip jesd5111 thermal test board design for pin grid array pga. High converter efficiency is achieved by integrating the currentlimited, lowresistance, highspeed highside and lowside switches and associated drive circuitry. Connect to the load and place output filter capacitors between these pins and pgnd pins 8 and 9. Eiajesd512 environment and pcb has standard footprint dimen sions connected with 5 a rated printed wiring trac k widths. Wp how to measure thermal resistance o e emitters an e arras white paer umiles holin all rihts resere ite ape how to measure thermal resistance of led emitters and led arrays.
There are thermal vias connecting the package to the two planes in the board. Mcp16331 ds20005308cpage 4 20142016 microchip technology inc. Esd protection a and b pins to gndb human body model 35 iec 642 air gap discharge 12 kv iec 642 contact discharge 10 esd protection all other pins human body model 4 kv max14941max14942 5kv isolated 20mbps halfduplex profibus rs485 transceivers with 35kv esd protection. Thermal characterization of ic packages maxim integrated. It is applicable for use by the package manufacturer i. Board temperature is measured on the top surface of the board near the package. Jedec5112 jesd5112 jesd511 jesd514 jesd517 jesd51 jesd518 app4083 an4083 text. Ja is the thermal resistance from junction to ambient, measured as cw. Tisp4xxxh3m3bj series for lcas protection absolute maximum ratings, ta 25 c unless otherwise noted rating symbol value unit repetitive peak offstate voltage, see note 7 4125 4219 vdrm 100 180 v nonrepetitive peak onstate pulse current see notes 8 and 9 itsp a 210. Test boards for area array surface mount package thermal measurements jesd51 10.
This standard covers the design of printed circuit boards pcbs used in the thermal characterization of ball grid array bga and land grid array lga packages. Battery protection ic with powersaving function for 1cell pack rev. Ta 25c table 9 ta 25c unless otherwise specified item symbol condition min. Reverse polarity protection 500 ma continuous operating. Full protection features include overcurrent protection ocp, overvoltage protection ovp, undervoltage protection uvp, and thermal shutdown. Summary of jedec thermal, multilayer testboard specification jesd51 7. Microsoft office lets you encrypt your office documents and pdf files, allowing no one to even view the file unless they have the password. Jb is the junctiontoboard thermalcharacterization parameter, measured in units of cw. The s82c1e series is a protection ic for lithiumion lithium polymer rechargeable batteries, which includes highaccuracy voltage detection circuits and delay circuits.
Jb measures component power flowing through multiple thermal paths rather than a single direct path, as in thermal. Jesd51 8 environmental conditions for a measurement of junctiontoboard thermal resistance jesd51 9 thermal test board design for ball grid array bga and land grid array lga jesd51 10 thermal test board design for dualinline packages dip and singleinline packages sip jesd51 11 thermal test board design for pin grid array pga. Jt junction to top characterization according to jesd512a1 3. The adp194 is a highside load switch designed for operation from 1. Thermal characterization of ic packages tutorial maxim. Logic controlled, highside power switch with reverse. Jesd51 9 was developed to give a figureofmerit of thermal performance that allows for accurate comparisons of packages from different suppliers. Board meets jesd519 specification for 1s or 2s2p board, respectively. Board meets jesd51 9 specification for 1s or 2s2p board, respectively.
The mcp163112 provides all the active functions for local dcdc conversion, with fast transient response and accurate regulation. Max14941max14942 v solate ps aldple bs s ransceiers. Ja using a procedure described in jesd512a sections 6 and 7. November 2006 fan7602 green current mode pwm controller. Jt, junction topofpackage, is a thermal metric to estimate junction temperature of a device on the customer application pcb jedec jesd512.
Jesd519, test boards for area array surface mount package thermal measurements, july 2000. Tps736xx capfree, nmos, 400ma lowdropout regulator. Summary of jedec thermal, multilayer testboard specification jesd517. The jesd5112, guidelines for reporting and using package thermal information, clarifies that thermal characterization parameters are not the same as thermal resistances. Tps736xx capfree, nmos, 400ma lowdropout regulator with. Vcc 12 v, cl 20 f, dvdt pin open, rlim 75, ta 25c characteristics symbol min typ max unit underovervoltage protection vout maximum vcc 18 v vout. The jesd51 12, guidelines for reporting and using package thermal information, clarifies that thermal characterization parameters are not the same as thermal resistances. How to password protect documents and pdfs with microsoft.
Unit test circuit detection voltage overcharge detection voltage vcu vcu 0. Soa curves are also important in the design of foldback circuits and in the design of switching circuits that operate between maxi. See jesd517 and jesd519 for detailed information regarding board construction. The bts70041epp is a smart highside power switch, providing protection functions and diagnosis. Mcp163112 ds20005255bpage 4 202014 microchip technology inc. Output voltage adjustment 4 3 3 ce onoff control 5 1 1 v. Jesd518, integrated circuit thermal test method environmental conditions junctiontoboard, oct. Ccw nc 33 fgo fg output 1fg or 3fg 14 vreg regulator output off at standby 34 enb enable input negative logic. All files and passwords are transferred using secure ssl connections. Modern versions of office use secure encryption that you can rely onassuming you set a strong password the instructions below apply to microsoft word, powerpoint, excel, and access 2016, but the process should be similar in other recent versions of. The device can withstand over 100,000 defib pulses without failure.
Per jedec jesd51 2 with natural convection for horizontally oriented board. Per semi g3887 and jedec jesd51 2 with the singlelayer board jesd51 3 horizontal. Datasheet stspin830 compact and versatile threephase and. When overvoltage protection is applied to transform er coupled lines from the transformer center tap to ground, the total ground return current can be 200 a, 10 and a, 210. The adp195 is a highside load switch designed for operation between 1. Per jedec jesd51 6 with the board jesd51 7 horizontal.